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Journal: Materials, 2012
Volume: 5
Page(s): 2151-2175
2151-2175
Article: Creep Behavior of a Sn-Ag-Bi Pb-Free Solder
Vianco, P.; Rejent, J.; Grazier, M.; Kilgo, A.

http://www.mdpi.com/1996-1944/5/11/2151

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