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Materials 2011, 4(6), 952-962; doi:10.3390/ma4060952
Article

Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated Circuits

1,* , 2
,
1
,
1
 and
1
1 Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095, USA 2 Department of Chemical Engineering, University of Pittsburg, Pittsburgh, PA 15260, USA
* Author to whom correspondence should be addressed.
Received: 9 May 2011 / Accepted: 23 May 2011 / Published: 25 May 2011
(This article belongs to the Special Issue Porous Materials 2011)
View Full-Text   |   Download PDF [703 KB, 26 May 2011; original version 25 May 2011]   |  

Abstract

A highly conductive moat or Faraday cage of through-the-wafer thickness in Si substrate was proposed to be effective in shielding electromagnetic interference thereby reducing radio frequency (RF) cross-talk in high performance mixed signal integrated circuits. Such a structure was realized by metallization of selected ultra-high-aspect-ratio macroporous regions that were electrochemically etched in p Si substrates. The metallization process was conducted by means of wet chemistry in an alkaline aqueous solution containing Ni2+ without reducing agent. It is found that at elevated temperature during immersion, Ni2+ was rapidly reduced and deposited into macroporous Si and a conformal metallization of the macropore sidewalls was obtained in a way that the entire porous Si framework was converted to Ni. A conductive moat was as a result incorporated into p Si substrate. The experimentally measured reduction of crosstalk in this structure is 5~18 dB at frequencies up to 35 GHz.
Keywords: RF cross-talk isolation; macroporous Si; Ni metallization RF cross-talk isolation; macroporous Si; Ni metallization
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).
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Zhang, X.; Xu, C.; Chong, K.; Tu, K.-N.; Xie, Y.-H. Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated Circuits. Materials 2011, 4, 952-962.

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