Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability
AbstractIn the past few years, the synthesis of Cu nanoparticles has attracted much attention because of its huge potential for replacing expensive nano silver inks utilized in conductive printing. A major problem in utilizing these copper nanoparticles is their inherent tendency to oxidize in ambient conditions. Recently, there have been several reports presenting various approaches which demonstrate that copper nanoparticles can resist oxidation under ambient conditions, if they are coated by a proper protective layer. This layer may consist of an organic polymer, alkene chains, amorphous carbon or graphenes, or inorganic materials such as silica, or an inert metal. Such coated copper nanoparticles enable achieving high conductivities by direct printing of conductive patterns. These approaches open new possibilities in printed electronics, for example by using copper based inkjet inks to form various devices such as solar cells, Radio Frequency Identification (RFID) tags, and electroluminescence devices. This paper provides a review on the synthesis of copper nanoparticles, mainly by wet chemistry routes, and their utilization in printed electronics. View Full-Text
Scifeed alert for new publicationsNever miss any articles matching your research from any publisher
- Get alerts for new papers matching your research
- Find out the new papers from selected authors
- Updated daily for 49'000+ journals and 6000+ publishers
- Define your Scifeed now
Magdassi, S.; Grouchko, M.; Kamyshny, A. Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability. Materials 2010, 3, 4626-4638.
Magdassi S, Grouchko M, Kamyshny A. Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability. Materials. 2010; 3(9):4626-4638.Chicago/Turabian Style
Magdassi, Shlomo; Grouchko, Michael; Kamyshny, Alexander. 2010. "Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability." Materials 3, no. 9: 4626-4638.