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Materials 2018, 11(9), 1642; https://doi.org/10.3390/ma11091642

Effects of Static Heat and Dynamic Current on Al/Zn∙Cu/Sn Solder/Ag Interfaces of Sn Photovoltaic Al-Ribbon Modules

1
The Instrument Center, National Cheng Kung University, Tainan 701, Taiwan
2
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
*
Author to whom correspondence should be addressed.
Received: 29 July 2018 / Revised: 28 August 2018 / Accepted: 3 September 2018 / Published: 7 September 2018
(This article belongs to the Special Issue Interface Engineering in Organic/Inorganic Hybrid Solar Cells)
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Abstract

This present study applied Cu∙Zn/Al ribbon in place of a traditional Cu ribbon to a photovoltaic (PV) ribbon. A hot-dipped and an electroplated Sn PV ribbon reflowed onto an Ag electrode on a Si solar cell and estimated the feasibility of the tested module (Ag/Solder/Cu∙Zn/Al). After bias-aging, a bias-induced thermal diffusion and an electromigration promoted the growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn). To simulate a photo-generated current in the series connection of solar cells, an electron with Ag-direction (electron flows from Ag to Al) and Al-direction (electron flows from Al to Ag) was passed through the Al/Zn∙Cu/Solder/Ag structure to clarify the growth mechanism of IMCs. An increase in resistance of the Ag-direction-biased module was higher than that of the Al-direction biased one due to the intense growth of Cu6Sn5 and Ag3Sn IMCs. The coated solder of the electroplated PV ribbon was less than that of the hot-dipped one, and thus decreased the growth reaction of IMCs and the cost of PV ribbon. View Full-Text
Keywords: Al ribbon; electroplated; electromigration; intermetallic compound Al ribbon; electroplated; electromigration; intermetallic compound
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Chen, K.-J.; Hung, F.-Y.; Lui, T.-S.; Lin, W.-Y. Effects of Static Heat and Dynamic Current on Al/Zn∙Cu/Sn Solder/Ag Interfaces of Sn Photovoltaic Al-Ribbon Modules. Materials 2018, 11, 1642.

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