Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS
AbstractA highly efficient and reproducible cleaning procedure of piezoelectric substrates is essential in surface acoustic waves (SAW) technology to fabricate high-quality SAW devices, especially for new applications such SAW sensors wherein new materials for piezoelectric substrates and interdigital transducers are used. Therefore, the development and critical evaluation of cleaning procedures for each material system that is under consideration becomes crucial. Contaminants like particles or the presence of organic/inorganic material on the substrate can dramatically influence and alter the properties of the thin film substrate composite, such as wettability, film adhesion, film texture, and so on. In this article, focus is given to different cleaning processes like SC-1 and SC-2, UV-ozone treatment, as well as cleaning by first-contact polymer Opticlean, which are applied for removal of contaminants from the piezoelectric substrate Ca
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Brachmann, E.; Seifert, M.; Oswald, S.; Menzel, S.B.; Gemming, T. Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS. Materials 2017, 10, 1373.
Brachmann E, Seifert M, Oswald S, Menzel SB, Gemming T. Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS. Materials. 2017; 10(12):1373.Chicago/Turabian Style
Brachmann, Erik; Seifert, Marietta; Oswald, Steffen; Menzel, Siegfried B.; Gemming, Thomas. 2017. "Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS." Materials 10, no. 12: 1373.
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