Next Article in Journal
Surface Modification of Carbon Nanotubes with an Enhanced Antifungal Activity for the Control of Plant Fungal Pathogen
Previous Article in Journal
Fabrication and Mechanical Behavior of Ex Situ Mg-Based Bulk Metallic Glass Matrix Composite Reinforced with Electroless Cu-Coated SiC Particles
Article Menu
Issue 12 (December) cover image

Export Article

Open AccessArticle
Materials 2017, 10(12), 1373; doi:10.3390/ma10121373

Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS

IFW Dresden, SAWLab Saxony, Helmholzstr. 20, 01069 Dresden, Germany
Author to whom correspondence should be addressed.
Received: 6 October 2017 / Revised: 24 November 2017 / Accepted: 25 November 2017 / Published: 30 November 2017
View Full-Text   |   Download PDF [1647 KB, uploaded 30 November 2017]   |  


A highly efficient and reproducible cleaning procedure of piezoelectric substrates is essential in surface acoustic waves (SAW) technology to fabricate high-quality SAW devices, especially for new applications such SAW sensors wherein new materials for piezoelectric substrates and interdigital transducers are used. Therefore, the development and critical evaluation of cleaning procedures for each material system that is under consideration becomes crucial. Contaminants like particles or the presence of organic/inorganic material on the substrate can dramatically influence and alter the properties of the thin film substrate composite, such as wettability, film adhesion, film texture, and so on. In this article, focus is given to different cleaning processes like SC-1 and SC-2, UV-ozone treatment, as well as cleaning by first-contact polymer Opticlean, which are applied for removal of contaminants from the piezoelectric substrate Ca 3 TaGa 3 Si 2 O 14 . By means of X-ray photoelectron spectroscopy, the presence of the most critical contaminants such as carbon, sodium, and iron removed through different cleaning procedures were studied and significant differences were observed between the outcomes of these procedures. Based on these results, a two-step cleaning process, combining SC-1 at a reduced temperature at 30 C instead of 80 C and a subsequent UV-ozone cleaning directly prior to deposition of the metallization, is suggested to achieve the lowest residual contamination level. View Full-Text
Keywords: surface contamination; cleaning procedures; UV-ozone cleaning; RCA clean; CTGS; XPS surface contamination; cleaning procedures; UV-ozone cleaning; RCA clean; CTGS; XPS

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Scifeed alert for new publications

Never miss any articles matching your research from any publisher
  • Get alerts for new papers matching your research
  • Find out the new papers from selected authors
  • Updated daily for 49'000+ journals and 6000+ publishers
  • Define your Scifeed now

SciFeed Share & Cite This Article

MDPI and ACS Style

Brachmann, E.; Seifert, M.; Oswald, S.; Menzel, S.B.; Gemming, T. Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS. Materials 2017, 10, 1373.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics



[Return to top]
Materials EISSN 1996-1944 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top