High-rise Buildings versus Outdoor Thermal Environment in Chongqing
AbstractThis paper gives a brief description of the over quick urbanization sinceChongqing, one of the biggest cities in China, has been a municipality directly under theCentral Government in 1997, excessive development and exceeding increase of high-risebuildings because of its special geographical position which finally leads to the worseningof the urban outdoor thermal environment. Then, this paper makes a bright balance to thefield measurement and simulated results of the wind speed field, temperature field of onemultifunctional high-rise building in Chongqing university located in the city center, andthe contrasted results validate the correctness of CFD in the outdoor thermal environmentalsimulation, expose the disadvantages of high-rise buildings on the aspects of blocking thewind field, decreasing wind speed which results in accumulation of the air-conditioningheat revolving around and periscian region where sunshine can not rip into. Finally, inorder to improve the urban outdoor thermal environment near the high-rise buildingsespecially for the angle of natural ventilation, this paper simulates the wind environment indifferent architectural compositions and architectural layouts by CFD, and the simulatedresults show that freestyle and tower buildings which can guarantee the wind speed andtake the air-conditioning heat away are much suitable and reasonable for the specialChongqing geography. These conclusions can also be used as a reference in othermountain cities, especially for the one with a great number of populations.
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Lu, J.; Chen, J.-H.; Tang, Y.; Wang, J.-S. High-rise Buildings versus Outdoor Thermal Environment in Chongqing. Sensors 2007, 7, 2183-2200.
Lu J, Chen J-H, Tang Y, Wang J-S. High-rise Buildings versus Outdoor Thermal Environment in Chongqing. Sensors. 2007; 7(10):2183-2200.Chicago/Turabian Style
Lu, Jun; Chen, Jin-hua; Tang, Ying; Wang, Jin-sha. 2007. "High-rise Buildings versus Outdoor Thermal Environment in Chongqing." Sensors 7, no. 10: 2183-2200.