Design Methodology of a Dual-Halbach Array Linear Actuator with Thermal-Electromagnetic Coupling
AbstractThis paper proposes a design methodology for linear actuators, considering thermal and electromagnetic coupling with geometrical and temperature constraints, that maximizes force density and minimizes force ripple. The method allows defining an actuator for given specifications in a step-by-step way so that requirements are met and the temperature within the device is maintained under or equal to its maximum allowed for continuous operation. According to the proposed method, the electromagnetic and thermal models are built with quasi-static parametric finite element models. The methodology was successfully applied to the design of a linear cylindrical actuator with a dual quasi-Halbach array of permanent magnets and a moving-coil. The actuator can produce an axial force of 120 N and a stroke of 80 mm. The paper also presents a comparative analysis between results obtained considering only an electromagnetic model and the thermal-electromagnetic coupled model. This comparison shows that the final designs for both cases differ significantly, especially regarding its active volume and its electrical and magnetic loading. Although in this paper the methodology was employed to design a specific actuator, its structure can be used to design a wide range of linear devices if the parametric models are adjusted for each particular actuator. View Full-Text
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Eckert, P.R.; Flores Filho, A.F.; Perondi, E.; Ferri, J.; Goltz, E. Design Methodology of a Dual-Halbach Array Linear Actuator with Thermal-Electromagnetic Coupling. Sensors 2016, 16, 360.
Eckert PR, Flores Filho AF, Perondi E, Ferri J, Goltz E. Design Methodology of a Dual-Halbach Array Linear Actuator with Thermal-Electromagnetic Coupling. Sensors. 2016; 16(3):360.Chicago/Turabian Style
Eckert, Paulo R.; Flores Filho, Aly F.; Perondi, Eduardo; Ferri, Jeferson; Goltz, Evandro. 2016. "Design Methodology of a Dual-Halbach Array Linear Actuator with Thermal-Electromagnetic Coupling." Sensors 16, no. 3: 360.
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