Abstract: The work reported on this paper describes a new methodology implementation for active structural health monitoring of recent aircraft parts made from carbon-fiber-reinforced polymer. This diagnosis is based on a new embedded method that is capable of measuring the local high frequency impedance spectrum of the structure through the calculation of the electro-mechanical impedance of a piezoelectric patch pasted non-permanently onto its surface. This paper involves both the laboratory based E/M impedance method development, its implementation into a CPU with limited resources as well as a comparison with experimental testing data needed to demonstrate the feasibility of flaw detection on composite materials and answer the question of the method reliability. The different development steps are presented and the integration issues are discussed. Furthermore, we present the unique advantages that the reconfigurable electronics through System-on-Chip (SoC) technology brings to the system scaling and flexibility. At the end of this article, we demonstrate the capability of a basic network of sensors mounted onto a real composite aircraft part specimen to capture its local impedance spectrum signature and to diagnosis different delamination sizes using a comparison with a baseline.
Keywords: structural health monitoring (SHM); composite aircraft structures; electro-mechanical impedance (EMI); PZT sensors; delaminations; System-on-Chip (SoC)
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Boukabache, H.; Escriba, C.; Zedek, S.; Medale, D.; Rolet, S.; Fourniols, J.Y. System-on-Chip Integration of a New Electromechanical Impedance Calculation Method for Aircraft Structure Health Monitoring. Sensors 2012, 12, 13617-13635.
Boukabache H, Escriba C, Zedek S, Medale D, Rolet S, Fourniols JY. System-on-Chip Integration of a New Electromechanical Impedance Calculation Method for Aircraft Structure Health Monitoring. Sensors. 2012; 12(10):13617-13635.
Boukabache, Hamza; Escriba, Christophe; Zedek, Sabeha; Medale, Daniel; Rolet, Sebastien; Fourniols, Jean Yves. 2012. "System-on-Chip Integration of a New Electromechanical Impedance Calculation Method for Aircraft Structure Health Monitoring." Sensors 12, no. 10: 13617-13635.