Sensors 2012, 12(10), 13617-13635; doi:10.3390/s121013617
Article

System-on-Chip Integration of a New Electromechanical Impedance Calculation Method for Aircraft Structure Health Monitoring

1 Le Laboratoire d’Analyse et d’Architecture des Systèmes (LAAS), French National Center for Scientific research (CNRS), 7 avenue du colonel Roche, F-31077 Toulouse, France 2 UPS, INSA, INP, ISAE, Université de Toulouse, F-31077 Toulouse, France 3 EADS-Innovation Works, F-31000 Toulouse, France
* Author to whom correspondence should be addressed.
Received: 18 August 2012; in revised form: 17 September 2012 / Accepted: 25 September 2012 / Published: 11 October 2012
(This article belongs to the Special Issue Piezoelectric Sensors and Actuators)
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Abstract: The work reported on this paper describes a new methodology implementation for active structural health monitoring of recent aircraft parts made from carbon-fiber-reinforced polymer. This diagnosis is based on a new embedded method that is capable of measuring the local high frequency impedance spectrum of the structure through the calculation of the electro-mechanical impedance of a piezoelectric patch pasted non-permanently onto its surface. This paper involves both the laboratory based E/M impedance method development, its implementation into a CPU with limited resources as well as a comparison with experimental testing data needed to demonstrate the feasibility of flaw detection on composite materials and answer the question of the method reliability. The different development steps are presented and the integration issues are discussed. Furthermore, we present the unique advantages that the reconfigurable electronics through System-on-Chip (SoC) technology brings to the system scaling and flexibility. At the end of this article, we demonstrate the capability of a basic network of sensors mounted onto a real composite aircraft part specimen to capture its local impedance spectrum signature and to diagnosis different delamination sizes using a comparison with a baseline.
Keywords: structural health monitoring (SHM); composite aircraft structures; electro-mechanical impedance (EMI); PZT sensors; delaminations; System-on-Chip (SoC)

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MDPI and ACS Style

Boukabache, H.; Escriba, C.; Zedek, S.; Medale, D.; Rolet, S.; Fourniols, J.Y. System-on-Chip Integration of a New Electromechanical Impedance Calculation Method for Aircraft Structure Health Monitoring. Sensors 2012, 12, 13617-13635.

AMA Style

Boukabache H, Escriba C, Zedek S, Medale D, Rolet S, Fourniols JY. System-on-Chip Integration of a New Electromechanical Impedance Calculation Method for Aircraft Structure Health Monitoring. Sensors. 2012; 12(10):13617-13635.

Chicago/Turabian Style

Boukabache, Hamza; Escriba, Christophe; Zedek, Sabeha; Medale, Daniel; Rolet, Sebastien; Fourniols, Jean Yves. 2012. "System-on-Chip Integration of a New Electromechanical Impedance Calculation Method for Aircraft Structure Health Monitoring." Sensors 12, no. 10: 13617-13635.

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