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Entropy 2003, 5(5), 467-481; doi:10.3390/e5050467

Convective Heating of Solid Surface: Entropy Generation Due to Temperature Field and Thermal Displacement

Mechanical Engineering Department, KFUPM, P.O. Box 1876, Dhahran 31261, Saudi Arabia
Received: 11 October 2002 / Accepted: 6 July 2003 / Published: 31 December 2003
(This article belongs to the Special Issue Entropy Generation in Thermal Systems and Processes)
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Abstract

Convective heating and cooling of the surfaces find application in process industry. During the heating or cooling cycle of the process, thermodynamic irreversibility which can be associated with the process parameters occurs. Moreover, thermodynamic irreversibility associated with the heating cycle can be quantified through entropy analysis. In the present study, convective heating of the solid surface is considered. A mathematical formulation of the temperature rise and thermal stress development during the transient heating process is presented. Entropy generation due to temperature field and thermal displacement is also formulated. The simulation for temperature rise, thermal displacement, and entropy generation are carried out for steel substrate. It is found that thermal displacement does not exactly follow the temperature distribution inside the substrate material. The magnitude of entropy generation due to temperature field is considerably higher than that corresponding to the thermal displacement.
Keywords: convective heating; thermal stress; thermal displacement; entropy generation convective heating; thermal stress; thermal displacement; entropy generation
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Al-Nassar, Y.N. Convective Heating of Solid Surface: Entropy Generation Due to Temperature Field and Thermal Displacement. Entropy 2003, 5, 467-481.

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