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Entropy 2015, 17(12), 8152-8173; doi:10.3390/e17127869

Design and Thermodynamic Analysis of a Steam Ejector Refrigeration/Heat Pump System for Naval Surface Ship Applications

Mechanical Engineering Department, Turkish Naval Academy, Istanbul 34942, Turkey
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Author to whom correspondence should be addressed.
Academic Editor: Kevin H. Knuth
Received: 8 September 2015 / Revised: 19 November 2015 / Accepted: 7 December 2015 / Published: 11 December 2015
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Abstract

Naval surface ships should use thermally driven heating and cooling technologies to continue the Navy’s leadership role in protecting the marine environment. Steam ejector refrigeration (SER) or steam ejector heat pump (SEHP) systems are thermally driven heating and cooling technologies and seem to be a promising technology to reduce emissions for heating and cooling on board naval surface ships. In this study, design and thermodynamic analysis of a seawater cooled SER and SEHP as an HVAC system for a naval surface ship application are presented and compared with those of a current typical naval ship system case, an H2O-LiBr absorption heat pump and a vapour-compression heat pump. The off-design study estimated the coefficient of performances (COPs) were 0.29–0.11 for the cooling mode and 1.29–1.11 for the heating mode, depending on the pressure of the exhaust gas boiler at off-design conditions. In the system operating at the exhaust gas boiler pressure of 0.2 MPa, the optimum area ratio obtained was 23.30. View Full-Text
Keywords: ship; engine; sea water; ejector system; refrigeration; heat pump ship; engine; sea water; ejector system; refrigeration; heat pump
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Ezgi, C.; Girgin, I. Design and Thermodynamic Analysis of a Steam Ejector Refrigeration/Heat Pump System for Naval Surface Ship Applications. Entropy 2015, 17, 8152-8173.

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