Next Article in Journal
Analysis of the Process Parameter Influence in Laser Cladding of 316L Stainless Steel
Previous Article in Journal
Using the Segmented Iterative Learning Control Method to Generate Volumetric Error-Compensated Part Programs for Three-Axis CNC Milling Machine Tools
Article Menu
Issue 3 (September) cover image

Export Article

Open AccessArticle
J. Manuf. Mater. Process. 2018, 2(3), 54; https://doi.org/10.3390/jmmp2030054

Dynamic Process Behavior in Laser Chemical Micro Machining of Metals

1
BIAS—Bremer Institut für Angewandte Strahltechnik, Klagenfurter Straße 5, 28359 Bremen, Germany
2
Wagenbrett GmbH & Co. KG, Sonneberger Straße 12, 28329 Bremen, Germany
*
Author to whom correspondence should be addressed.
Received: 18 July 2018 / Revised: 9 August 2018 / Accepted: 11 August 2018 / Published: 14 August 2018
Full-Text   |   PDF [9851 KB, uploaded 24 August 2018]   |  

Abstract

Laser chemical machining (LCM) is a non-conventional processing method that enables a smooth and precise micro structuring of metallic surfaces. However, a high-quality removal is limited to a laser power window of some 100 mW. This is due to the high sensibility to removal disturbances, such as the deposition of metallic salts and oxides. In this work, the dynamic process behavior around the transition from a disturbance-free to a disturbed removal is investigated for the laser chemical machining of titanium (3.7024) and stainless steel (AISI 304) in different phosphoric acid solutions. Therefore, the removal cavities are recorded using confocal scanning microscopy and characterized regarding width, depth and quality in dependence of the laser power, feed velocity and electrolyte concentration. While the removal characteristics within the disturbance-free regime are found to be material-independent, the disturbed regime is strongly dependent on the tendency of the material to gas bubble adherence. Additional CCD records of the interaction zone reveal that the transition to the disturbed regime is accompanied by significant light reflections and thereby indicate the influence of adhering gas bubbles on disturbing the removal process. Moreover, typical removal disturbances are presented and discussed with regard to the responsible mechanisms for their occurrence. View Full-Text
Keywords: laser micro machining; laser chemical removal; machining disturbance; quality laser micro machining; laser chemical removal; machining disturbance; quality
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Supplementary material

SciFeed

Share & Cite This Article

MDPI and ACS Style

Mehrafsun, S.; Messaoudi, H. Dynamic Process Behavior in Laser Chemical Micro Machining of Metals. J. Manuf. Mater. Process. 2018, 2, 54.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
J. Manuf. Mater. Process. EISSN 2504-4494 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top