Precise In-Process Strain Measurements for the Investigation of Surface Modification Mechanisms
AbstractThe question, how certain surface layer properties (for example, hardness or roughness) can be specifically influenced in different manufacturing processes, is of great economic interest. A prerequisite for the investigation of the formation of surface layer properties is the metrological assessment of the material stresses during processing. Up to now, no commercial in-process measuring system exists, which is able to determine material stresses in the form of mechanical strains in high-dynamic manufacturing processes with sufficient accuracy. A detailed analysis of the resolution limits shows that speckle photography enables deformation measurements with a resolution in the single-digit nanometer range. Thus, speckle photography basically offers the potential to measure material stresses during processing. Using the example of single-tooth milling, the applicability of speckle photography for in-process stress measurements is demonstrated. Even in such highly dynamic manufacturing processes with cutting speeds up to 10 m/s, the absolute measurement uncertainty of the strain is less than 0.05%. This is more than one order of magnitude lower than the occurring maximal strain. Therefore, speckle photography is suitable for characterizing the dynamic stresses and the material deformations in manufacturing processes. View Full-Text
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Tausendfreund, A.; Stöbener, D.; Fischer, A. Precise In-Process Strain Measurements for the Investigation of Surface Modification Mechanisms. J. Manuf. Mater. Process. 2018, 2, 9.
Tausendfreund A, Stöbener D, Fischer A. Precise In-Process Strain Measurements for the Investigation of Surface Modification Mechanisms. Journal of Manufacturing and Materials Processing. 2018; 2(1):9.Chicago/Turabian Style
Tausendfreund, Andreas; Stöbener, Dirk; Fischer, Andreas. 2018. "Precise In-Process Strain Measurements for the Investigation of Surface Modification Mechanisms." J. Manuf. Mater. Process. 2, no. 1: 9.
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