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Proceedings 2017, 1(4), 609; doi:10.3390/proceedings1040609

3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping

CTR Carinthian Tech Research AG, Europastrasse 12, A-9524 Villach, Austria
Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
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Published: 29 August 2017
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Abstract

A rapid advanced packaging concept, consisting of inkjet photopolymer printing and Ag nanoparticles printing, was investigated for the construction of a pressure sensor package. Acrylate-type 3D package housing with 7 through-holes was printed with a polyjet printer and the through-vias and connection pads were manufactured via Ag glue dispensing and inkjet printing of Ag nanoparticle ink. The flip-chip packaging concept was pursued for the electrical connection between the package and the pressure sensor dye.
Keywords: rapid advanced prototyping; inkjet printing; sensor packaging rapid advanced prototyping; inkjet printing; sensor packaging
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Krivec, M.; Roshanghias, A.; Binder, A. 3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping. Proceedings 2017, 1, 609.

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