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Metals 2016, 6(5), 115; doi:10.3390/met6050115

Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains

1
School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China
2
School of Mechanical Engineering, Wuhan Polytechnic University, Wuhan 430023, China
*
Author to whom correspondence should be addressed.
Academic Editor: Hugo F. Lopez
Received: 1 April 2016 / Revised: 22 April 2016 / Accepted: 11 May 2016 / Published: 17 May 2016
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Abstract

By modifying the accumulative roll-bonding (ARB) procedures, accumulative roll-bonding (ARB) processing up to 30 cycles (N) with a 50% thickness reduction per cycle (equivalent strain = 24) at room temperature was conducted on pure copper. The bonding condition, microhardness and electrical conductivity of the ARBed Cu were studied. Results showed that good bonding condition of the samples was achieved. As N increases, the microhardness of ARBed Cu increases, reaching ~2.9 times that of annealed Cu for N = 30. The electrical conductivity of ARBed Cu decreases slightly but with periodic fluctuations for N > 10, with a minimum of 90.4% IACS for N = 30. Our study indicated that ARB can be an effective way to produce high-hardness and high-conductivity pure copper better than or comparable to Cu alloys and Cu based composites as reported. View Full-Text
Keywords: accumulative roll-bonding; pure copper; microhardness; electrical conductivity accumulative roll-bonding; pure copper; microhardness; electrical conductivity
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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Yao, G.; Mei, Q.; Li, J.; Li, C.; Ma, Y.; Chen, F.; Zhang, G.; Yang, B. Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains. Metals 2016, 6, 115.

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