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Materials 2016, 9(7), 569; doi:10.3390/ma9070569

Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy

1,2,* , 1,3
,
1,2
and
1,2,*
1
Key Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, Shenyang 110004, China
2
School of Metallurgy, Northeastern University, Shenyang 110004, China
3
School of Materials Science and Engineering, Northeastern University, Shenyang 110004, China
*
Authors to whom correspondence should be addressed.
Academic Editor: Daolun Chen
Received: 21 June 2016 / Revised: 7 July 2016 / Accepted: 8 July 2016 / Published: 13 July 2016
(This article belongs to the Section Manufacturing Processes and Systems)
View Full-Text   |   Download PDF [3396 KB, uploaded 13 July 2016]   |  

Abstract

We report the influence of growth rate and external magnetic field on the eutectic lamellar spacing and properties of directionally-solidified Ag-Cu eutectic alloys. The results indicated that the relationship between the lamellar spacing of directionally-solidified Ag-Cu alloys and the growth rate matched the prediction of the Jackson-Hunt model, and the constant was 5.8 µm3/s. The increasing external magnetic field during solidification tilted the growth direction of the lamellar eutectics, and coarsened the eutectic lamellar spacing. These decreased the microhardness and strength of Ag-Cu alloys, but increased their electrical conductivity. The competitive strengthening contributions between the refinement of the eutectic lamellar spacing and the change in growth direction of the eutectics resulted in higher strength in the as-rolled sample with a 0.8 T magnetic field than with other samples, which was confirmed from higher relieved deformation energy using differential scanning calorimetry. View Full-Text
Keywords: Ag-Cu eutectic alloy; magnetic field; growth rate; eutectic lamellar spacing; microhardness; strength Ag-Cu eutectic alloy; magnetic field; growth rate; eutectic lamellar spacing; microhardness; strength
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Zuo, X.; Zhao, C.; Zhang, L.; Wang, E. Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy. Materials 2016, 9, 569.

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