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Materials 2014, 7(12), 7737-7751; doi:10.3390/ma7127737

Surface Characteristics and Catalytic Activity of Copper Deposited Porous Silicon Powder

Nanoscience Research Laboratory, School of Chemical Sciences, Universiti Sains Malaysia, Penang 11800, Malaysia
These authors contributed equally to this work.
Author to whom correspondence should be addressed.
Received: 29 August 2014 / Revised: 7 November 2014 / Accepted: 13 November 2014 / Published: 4 December 2014
(This article belongs to the Section Porous Materials)
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Porous structured silicon or porous silicon (PS) powder was prepared by chemical etching of silicon powder in an etchant solution of HF: HNO3: H2O (1:3:5 v/v). An immersion time of 4 min was sufficient for depositing Cu metal from an aqueous solution of CuSO4 in the presence of HF. Scanning electron microscopy (SEM) analysis revealed that the Cu particles aggregated upon an increase in metal content from 3.3 wt% to 9.8 wt%. H2-temperature programmed reduction (H2-TPR) profiles reveal that re-oxidation of the Cu particles occurs after deposition. Furthermore, the profiles denote the existence of various sizes of Cu metal on the PS. The Cu-PS powders show excellent catalytic reduction on the p-nitrophenol regardless of the Cu loadings. View Full-Text
Keywords: porous silicon powder; Cu particles; surface properties; p-nitrophenol porous silicon powder; Cu particles; surface properties; p-nitrophenol

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Halim, M.Y.A.; Tan, W.L.; Bakar, N.H.H.A.; Bakar, M.A. Surface Characteristics and Catalytic Activity of Copper Deposited Porous Silicon Powder. Materials 2014, 7, 7737-7751.

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