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Materials 2014, 7(12), 7706-7721; doi:10.3390/ma7127706

Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

Faculty of Engineering & Built Environment, National University of Malaysia, Selangor, 43600 UKM, Bangi, Malaysia
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Received: 2 September 2014 / Revised: 13 October 2014 / Accepted: 25 November 2014 / Published: 2 December 2014
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Abstract

The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB). The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP) machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm), and the solder height is the table speed of the SP machine (2.5 mm/s). View Full-Text
Keywords: solder paste; fine-pitch component; dynamic characteristic; thermal shock; Taguchi method; solder joint solder paste; fine-pitch component; dynamic characteristic; thermal shock; Taguchi method; solder joint
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Rahman, M.N.A.; Zubir, N.S.M.; Leuveano, R.A.C.; Ghani, J.A.; Mahmood, W.M.F.W. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components. Materials 2014, 7, 7706-7721.

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