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Materials 2013, 6(1), 143-155; doi:10.3390/ma6010143

Design of High Impedance Electromagnetic Surfaces for Mutual Coupling Reduction in Patch Antenna Array

1
Institute of Space Science (ANGKASA), Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia
2
Department of Electrical, Electronic and Systems Engineering, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia
*
Author to whom correspondence should be addressed.
Received: 22 October 2012 / Revised: 28 December 2012 / Accepted: 4 January 2013 / Published: 7 January 2013
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Abstract

A compact planar meander-bridge high impedance electromagnetic structure (MBHIES) was designed and its bandgap characteristics, mutual coupling reduction abilities were studied and compared in detail. Several parametric analyses were performed to obtain optimized design values and the transmission responses were calculated through the suspended microstrip line and waveguide simulation methods. The achieved bandgap is 2.3 GHz (2.55–4.85 GHz) with −61 dB minimum transmission coefficient level at the center frequency of 3.6 GHz. To see the effectiveness, the proposed design was inserted between a microstrip patch antenna array which operates at 3.8 GHz and whose operating bandwidth falls within the MBHIES bandgap. The surface wave suppression phenomenon was analyzed and simulated results are verified by measuring the fabricated prototypes, both are in good agreement. The configuration reduced the mutual coupling by 20.69 dB in simulation and 19.18 dB in measurement, without affecting the radiation characteristics of the array but increasing the gain slightly. View Full-Text
Keywords: high impedance surfaces; meandered line; bandgap; array; mutual coupling high impedance surfaces; meandered line; bandgap; array; mutual coupling
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Islam, M.T.; Alam, M.S. Design of High Impedance Electromagnetic Surfaces for Mutual Coupling Reduction in Patch Antenna Array. Materials 2013, 6, 143-155.

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