Materials 2010, 3(4), 2606-2617; doi:10.3390/ma3042606
Article

Low-Thermal-Conductivity (MS)1+x(TiS2)2 (M = Pb, Bi, Sn) Misfit Layer Compounds for Bulk Thermoelectric Materials

1,2email, 1,2email, 1email and 1,2,* email
Received: 1 January 2010; in revised form: 25 February 2010 / Accepted: 1 April 2010 / Published: 6 April 2010
(This article belongs to the Special Issue Novel Thermoelectric Materials and Applications)
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract: A series of (MS)1+x(TiS2)2 (M = Pb, Bi, Sn) misfit layer compounds are proposed as bulk thermoelectric materials. They are composed of alternating rock-salt-type MS layers and paired trigonal anti-prismatic TiS2 layers with a van der Waals gap. This naturally modulated structure shows low lattice thermal conductivity close to or even lower than the predicted minimum thermal conductivity. Measurement of sound velocities shows that the ultra-low thermal conductivity partially originates from the softening of the transverse modes of lattice wave due to weak interlayer bonding. Combined with a high power factor, the misfit layer compounds show a relatively high ZT value of 0.28~0.37 at 700 K.
Keywords: thermoelectric materials; misfit layer compounds; sound velocity; interlayer bonding
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MDPI and ACS Style

Wan, C.; Wang, Y.; Wang, N.; Koumoto, K. Low-Thermal-Conductivity (MS)1+x(TiS2)2 (M = Pb, Bi, Sn) Misfit Layer Compounds for Bulk Thermoelectric Materials. Materials 2010, 3, 2606-2617.

AMA Style

Wan C, Wang Y, Wang N, Koumoto K. Low-Thermal-Conductivity (MS)1+x(TiS2)2 (M = Pb, Bi, Sn) Misfit Layer Compounds for Bulk Thermoelectric Materials. Materials. 2010; 3(4):2606-2617.

Chicago/Turabian Style

Wan, Chunlei; Wang, Yifeng; Wang, Ning; Koumoto, Kunihito. 2010. "Low-Thermal-Conductivity (MS)1+x(TiS2)2 (M = Pb, Bi, Sn) Misfit Layer Compounds for Bulk Thermoelectric Materials." Materials 3, no. 4: 2606-2617.

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