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Materials 2010, 3(1), 318-328; doi:10.3390/ma3010318

The Effect of (Ag, Ni, Zn)-Addition on the Thermoelectric Properties of Copper Aluminate

Department of Electrical and Electronic Engineering, Hakodate National College of Technology, 14-1 Tokura, Hakodate, Hokkaido 042-8501, Japan
Fuel Cells and Solid State Chemistry Division, Risø National Laboratory for Sustainable Energy, Technical University of Denmark, Roskilde 4000, Denmark
Author to whom correspondence should be addressed.
Received: 21 December 2009 / Revised: 7 January 2010 / Accepted: 8 January 2010 / Published: 11 January 2010
(This article belongs to the Special Issue Novel Thermoelectric Materials and Applications)
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Polycrystalline bulk copper aluminate Cu1-x-yAgxByAlO2 with B = Ni or Zn were prepared by spark plasma sintering and subsequent thermal treatment. The influence of partial substitution of Ag, Ni and Zn for Cu-sites in CuAlO2 on the high temperature thermoelectric properties has been studied. The addition of Ag and Zn was found to enhance the formation of CuAlO2 phase and to increase the electrical conductivity. The addition of Ag or Ag and Ni on the other hand decreases the electrical conductivity. The highest power factor of 1.26 × 10-4 W/mK2 was obtained for the addition of Ag and Zn at 1,060 K, indicating a significant improvement compared with the non-doped CuAlO2 sample. View Full-Text
Keywords: copper aluminate; oxide material; element addition; thermoelectric properties copper aluminate; oxide material; element addition; thermoelectric properties

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MDPI and ACS Style

Yanagiya, S.-I.; Van Nong, N.; Xu, J.; Pryds, N. The Effect of (Ag, Ni, Zn)-Addition on the Thermoelectric Properties of Copper Aluminate. Materials 2010, 3, 318-328.

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