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Materials 2009, 2(4), 2467-2495; doi:10.3390/ma2042467

Thermal Conductivity of Diamond Composites

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Received: 1 November 2009; in revised form: 16 December 2009 / Accepted: 17 December 2009 / Published: 21 December 2009
(This article belongs to the Special Issue Composite Materials)
Download PDF [1608 KB, uploaded 21 December 2009]
Abstract: A major problem challenging specialists in present-day materials sciences is the development of compact, cheap to fabricate heat sinks for electronic devices, primarily for computer processors, semiconductor lasers, high-power microchips, and electronics components. The materials currently used for heat sinks of such devices are aluminum and copper, with thermal conductivities of about 250 W/(m·K) and 400 W/(m·K), respectively. Significantly, the thermal expansion coefficient of metals differs markedly from those of the materials employed in semiconductor electronics (mostly silicon); one should add here the low electrical resistivity metals possess. By contrast, natural single-crystal diamond is known to feature the highest thermal conductivity of all the bulk materials studied thus far, as high as 2,200 W/(m·K). Needless to say, it cannot be applied in heat removal technology because of high cost. Recently, SiC- and AlN-based ceramics have started enjoying wide use as heat sink materials; the thermal conductivity of such composites, however, is inferior to that of metals by nearly a factor two. This prompts a challenging scientific problem to develop diamond-based composites with thermal characteristics superior to those of aluminum and copper, adjustable thermal expansion coefficient, low electrical conductivity and a moderate cost, below that of the natural single-crystal diamond. The present review addresses this problem and appraises the results reached by now in studying the possibility of developing composites in diamond-containing systems with a view of obtaining materials with a high thermal conductivity.
Keywords: diamond; thermal conductivity; heat sink; composite; nanodiamond; high pressures; infiltration; spark plasma sintering diamond; thermal conductivity; heat sink; composite; nanodiamond; high pressures; infiltration; spark plasma sintering
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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MDPI and ACS Style

Kidalov, S.V.; Shakhov, F.M. Thermal Conductivity of Diamond Composites. Materials 2009, 2, 2467-2495.

AMA Style

Kidalov SV, Shakhov FM. Thermal Conductivity of Diamond Composites. Materials. 2009; 2(4):2467-2495.

Chicago/Turabian Style

Kidalov, Sergey V.; Shakhov, Fedor M. 2009. "Thermal Conductivity of Diamond Composites." Materials 2, no. 4: 2467-2495.

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