Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing
AbstractThe development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations. View Full-Text
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Ji, S.Y.; Choi, W.; Kim, H.-Y.; Jeon, J.-W.; Cho, S.-H.; Chang, W.S. Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing. Materials 2018, 11, 268.
Ji SY, Choi W, Kim H-Y, Jeon J-W, Cho S-H, Chang WS. Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing. Materials. 2018; 11(2):268.Chicago/Turabian Style
Ji, Seok Y.; Choi, Wonsuk; Kim, Hoon-Young; Jeon, Jin-Woo; Cho, Sung-Hak; Chang, Won S. 2018. "Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing." Materials 11, no. 2: 268.