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Materials 2017, 10(8), 942; doi:10.3390/ma10080942

Electroless Nickel Deposition for Front Side Metallization of Silicon Solar Cells

1
Department of Materials Science and Engineering, National Formosa University, 64, Wunhua Road, Huwei, Yunlin 632, Taiwan
2
Graduate School of Materials Science, National Yunlin University of Science and Technology, 123 University Road, Section 3, Douliou, Yunlin 640, Taiwan
3
Motech Industries Inc., No.2, Dashun 9th Rd., Xinshi Dist., Tainan 741, Taiwan
*
Author to whom correspondence should be addressed.
Received: 18 July 2017 / Revised: 3 August 2017 / Accepted: 8 August 2017 / Published: 14 August 2017
(This article belongs to the Section Energy Materials)
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Abstract

In this work, nickel thin films were deposited on texture silicon by electroless plated deposition. The electroless-deposited Ni layers were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction analysis (XRD), and sheet resistance measurement. The results indicate that the dominant phase was Ni2Si and NiSi in samples annealed at 300–800 °C. Sheet resistance values were found to correlate well with the surface morphology obtained by SEM and the results of XRD diffraction. The Cu/Ni contact system was used to fabricate solar cells by using two different activating baths. The open circuit voltage (Voc) of the Cu/Ni samples, before and after annealing, was measured under air mass (AM) 1.5 conditions to determine solar cell properties. The results show that open circuit voltage of a solar cell can be enhanced when the activation solution incorporated hydrofluoric acid (HF). This is mainly attributed to the native silicon oxide layer that can be decreased and/or removed by HF with the corresponding reduction of series resistance. View Full-Text
Keywords: solar cell; electroless; Cu/Ni contact; open circuit voltage solar cell; electroless; Cu/Ni contact; open circuit voltage
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Hsieh, S.H.; Hsieh, J.M.; Chen, W.J.; Chuang, C.C. Electroless Nickel Deposition for Front Side Metallization of Silicon Solar Cells. Materials 2017, 10, 942.

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