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Materials 2017, 10(10), 1128; doi:10.3390/ma10101128

Interfacial Bonding Energy on the Interface between ZChSnSb/Sn Alloy Layer and Steel Body at Microscale

1
Engineering Research Center Heavy Machinery Ministry of Education, Taiyuan University of Science and Technology, Taiyuan 030024, China
2
School of Mechatronic Engineering, China University of Mining Technology, Xuzhou 221116, China
3
School of Manufacturing & Mechanical Engineering, UNSW, Sydney 2200, Australia
*
Author to whom correspondence should be addressed.
Received: 21 August 2017 / Revised: 21 September 2017 / Accepted: 21 September 2017 / Published: 25 September 2017
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Abstract

To investigate the performance of bonding on the interface between ZChSnSb/Sn and steel body, the interfacial bonding energy on the interface of a ZChSnSb/Sn alloy layer and the steel body with or without Sn as an intermediate layer was calculated under the same loadcase using the molecular dynamics simulation software Materials Studio by ACCELRYS, and the interfacial bonding energy under different Babbitt thicknesses was compared. The results show that the bonding energy of the interface with Sn as an intermediate layer is 10% larger than that of the interface without a Sn layer. The interfacial bonding performances of Babbitt and the steel body with Sn as an intermediate layer are better than those of an interface without a Sn layer. When the thickness of the Babbitt layer of bushing is 17.143 Å, the interfacial bonding energy reaches the maximum, and the interfacial bonding performance is optimum. These findings illustrate the bonding mechanism of the interfacial structure from the molecular level so as to ensure the good bonding properties of the interface, which provides a reference for the improvement of the bush manufacturing process from the microscopic point of view. View Full-Text
Keywords: molecular dynamics; Sn layer; interfacial bonding performances; bonding strength; Babbitt layer thickness molecular dynamics; Sn layer; interfacial bonding performances; bonding strength; Babbitt layer thickness
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Wang, J.; Xia, Q.; Ma, Y.; Meng, F.; Liang, Y.; Li, Z. Interfacial Bonding Energy on the Interface between ZChSnSb/Sn Alloy Layer and Steel Body at Microscale. Materials 2017, 10, 1128.

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