Int. J. Mol. Sci. 2014, 15(4), 6412-6422; doi:10.3390/ijms15046412
Article

Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate

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Received: 24 February 2014; in revised form: 4 April 2014 / Accepted: 8 April 2014 / Published: 15 April 2014
(This article belongs to the Special Issue Advances in Anisotropic and Smart Materials)
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract: Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111) preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance.
Keywords: ABS resin; SAMs; electroless copper film; heterocyclic silane
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MDPI and ACS Style

Xu, J.; Fan, R.; Wang, J.; Jia, M.; Xiong, X.; Wang, F. Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate. Int. J. Mol. Sci. 2014, 15, 6412-6422.

AMA Style

Xu J, Fan R, Wang J, Jia M, Xiong X, Wang F. Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate. International Journal of Molecular Sciences. 2014; 15(4):6412-6422.

Chicago/Turabian Style

Xu, Jiushuai; Fan, Ruibin; Wang, Jiaolong; Jia, Mengke; Xiong, Xuanrui; Wang, Fang. 2014. "Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate." Int. J. Mol. Sci. 15, no. 4: 6412-6422.


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