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Exploring the Sensing Potential of Acoustic Wave Devices

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Biosensors".

Deadline for manuscript submissions: 30 December 2024 | Viewed by 498

Special Issue Editors


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Guest Editor
Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Physics and Optoelectronic Engineering, Shenzhen University, Shenzhen 518060, China
Interests: piezoelectric thin films; acoustic microdevices

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Guest Editor
Department of Materials, Imperial College London, London SW7 2AZ, UK
Interests: biosensor; bioelectronics; MEMS; 2D biomaterials

Special Issue Information

Dear Colleagues,

Acoustic wave devices are instrumental in various applications, leveraging the sensing potential of acoustic waves for precise and sensitive measurements. Acoustic wave devices, such as surface acoustic wave (SAW) devices and bulk acoustic wave (BAW) devices, operate based on the propagation of mechanical waves through a substrate material. These devices exploit the interaction between acoustic waves and the material properties to enable sensing capabilities. Changes in the physical or chemical properties of the material in contact with the acoustic wave can lead to detectable alterations in the wave characteristics, allowing for precise measurements. In addition, acoustic wave devices based on MEMS fabrication technology can be miniaturized, allowing for compact and portable sensing systems to be developed. Integration with microelectronics enables the creation of sensor arrays and multi-sensor platforms for simultaneous detection of multiple analytes. Acoustic wave devices are widely employed in gas and chemical, biosensing sensing, temperature, and pressure sensing applications due to their sensitivity, fast response times, and miniaturization capabilities. This Special Issue explores acoustic wave sensing technology's latest advancements and applications. We invite original research papers and review articles showcasing significant developments in these fields. Potential areas of interest include, but are not limited to:

  • Capacitive Acoustic Wave Sensor;
  • Piezoelectric Acoustic Wave Sensor;
  • MEMS Acoustic Wave Sensor;
  • Fiber-Optic Acoustic Wave Sensor;
  • Surface Acoustic Wave (SAW) Sensor;
  • Bulk Acoustic Wave (BAW) Sensor;
  • Acoustic Emission Sensor;
  • Microphone;
  • Ultrasonic Sensor;
  • Infrasonic Sensor;
  • Sonar Sensor;
  • Acoustic Camera.

Dr. Chen Fu
Dr. Sami Ramadan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • acoustic wave sensors
  • acoustic emission sensors
  • ultrasonic sensors

Published Papers (1 paper)

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Research

17 pages, 2842 KiB  
Article
FEM Modeling Strategies: Application to Mechanical and Dielectric Sensitivities of Love Wave Devices in Liquid Medium
by Maxence Rube, Ollivier Tamarin, Asawari Choudhari, Martine Sebeloue, Dominique Rebiere and Corinne Dejous
Sensors 2024, 24(10), 2976; https://doi.org/10.3390/s24102976 - 8 May 2024
Viewed by 357
Abstract
This paper presents an extended work on the Finite Element Method (FEM) simulation of Love Wave (LW) sensors in a liquid medium. Two models are proposed to simulate the multiphysical response of the sensor. Both are extensively described in terms of principle, composition [...] Read more.
This paper presents an extended work on the Finite Element Method (FEM) simulation of Love Wave (LW) sensors in a liquid medium. Two models are proposed to simulate the multiphysical response of the sensor. Both are extensively described in terms of principle, composition and behavior, making their applications easily reproducible by the sensor community. The first model is a Representative Volume Element (RVE) simulating the transducer and the second focuses on the sensor’s longitudinal (OXZ) cut which simulates the multiphysical responses of the device. Sensitivity of the LW device to variations in the rheological and dielectric properties of liquids is estimated and then compared to a large set of measurements issued from LW sensors presenting different technological characteristics. This integral approach allows for a deeper insight into the multiphysical behavior of the LW sensor. This article also explores the advantages and drawbacks of each model. Both are in good accordance with the measurements and could be used for various applications, for which a non-exhaustive list is proposed in the conclusion. Full article
(This article belongs to the Special Issue Exploring the Sensing Potential of Acoustic Wave Devices)
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