Skip Content
You are currently on the new version of our website. Access the old version .
  • Indexed in
    Scopus
  • 23 days
    Time to First Decision

Special Issues

Open for Submission

High-Performance Packaging Substrates for Chiplet Integration: Materials, Process and Reliability

Guest Editor: Shanjun Ding
Viewed by 232

Deadline: 31 December 2026

Open for Submission

Advances in Power Management Integrated Circuits (PMICs)

Guest Editor: Zhanghao Yu
1 article | Viewed by 1,862

Deadline: 30 November 2026

Open for Submission

Emerging Issues in Hardware and IC System Security

Guest Editor: Zain Ul Abideen
2 articles | Viewed by 2,117

Deadline: 30 November 2026

Open for Submission

Magnetoresistive Random-Access Memory (MRAM): Present and Future

Guest Editor: Cheng Wang
1 article | Viewed by 6,547

Deadline: 31 October 2026

Open for Submission

Design and Implementation of Reconfigurable Optoelectronic Integrated Chips

Guest Editor: Jiyuan Zheng
1 article | Viewed by 491

Deadline: 31 October 2026

Open for Submission

New Research in Microelectronics and Electronics

Guest Editors: Gianluca Giustolisi, Elisabetta Moisello
9 articles | Viewed by 28,779

Deadline: 30 September 2026

Open for Submission

IC Design Techniques for Power/Energy-Constrained Applications

Guest Editors: Andrea Ballo, Orazio Aiello
12 articles | Viewed by 32,994

Deadline: 31 July 2026

Open for Submission

Silicon Photonic Integrated Circuits: Advancements and Challenges

Guest Editors: Stanley Cheung, Yingtao Hu
2 articles | Viewed by 12,123

Deadline: 30 June 2026

Open for Submission

Neuromorphic Chips at the Intersection of Neuroscience, Electronics and AI

Guest Editors: Liangshun Wu, Pak Kwong Chan
1 article | Viewed by 1,095

Deadline: 30 April 2026

Get Alerted

Add your email address to receive forthcoming issues of this journal.

XFacebookLinkedIn
Chips - ISSN 2674-0729