Special Issue "UAV Photogrammetry for 3D Modeling"

A special issue of Remote Sensing (ISSN 2072-4292). This special issue belongs to the section "Engineering Remote Sensing".

Deadline for manuscript submissions: 30 September 2021.

Special Issue Editors

Prof. Dr. Efstratios Stylianidis
E-Mail Website
Guest Editor
School of Spatial Planning and Development, Aristotle University of Thessaloniki, 541 24 Thessaloniki, Greece
Interests: photogrammetry; geomatics; cultural heritage; documentation
Special Issues and Collections in MDPI journals
Prof. Dr. Luis Javier Sánchez-Aparicio
E-Mail Website
Guest Editor
Department of Construction and Technology in Architecture, Higher Technical School of Architecture of Madrid, Polytechnic School of Madrid, Av. Juan de Herrera, 4 28040 Madrid, Spain
Interests: cultural heritage; geoinformatics applied to preventive conservation and diagnosis; 3D modeling; structural analysis; photogrammetry; laser scanning
Special Issues and Collections in MDPI journals

Special Issue Information

Dear Colleagues,

Unmanned aerial vehicles (UAVs) have been extensively used in many application areas. They are able to carry several sensors, capture aerial imagery, or even acquire point clouds depending on the application area and the sensor equipped on the UAV.

This Special Issue aspires to focus on the latest advances in 3D modeling issues, targeting both natural and built environments. This Special Issue seeks high-quality papers that explore all the potentialities offered by these platforms and the latest developments in data acquisition, processing, and 3D modeling in a wide spectrum of applications.

I would like to invite you to contribute to this Special Issue “UAV Photogrammetry for 3D Modeling” by submitting articles concerning your recent research, experimental work, reviews, and/or case studies related to the topic encapsulated by the title. Contributions may be on UAV image processing methods for photogrammetric applications, mapping and 3D modeling issues, and any other aspects related to the Special Issue theme.

This Special Issue provides a scientific basis for any researcher and professional in the UAV ecosystem to make the best possible use and presentation of technological developments, both in hardware and software, toward using this incredible ‘infrastructure’ in the entire 3D modeling workflow.

You may choose our Joint Special Issue in Drones.

Prof. Dr. Efstratios Stylianidis
Prof. Dr. Luis Javier Sánchez-Aparicio
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Remote Sensing is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Unmanned aerial vehicles, drones
  • 3D modeling
  • Photogrammetry, computer vision, and remote sensing
  • Mapping, surveying
  • Sensors
  • Natural environment, built environment

Related Special Issue

Published Papers

This special issue is now open for submission.
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