Advanced Digital and Other Processes

A section of Processes (ISSN 2227-9717).

Section Information

The section is focused on applications of digitalization, Internet of Things (IoT), additive technologies (3D printing), cloud data storage, smart sensors, artificial intelligence (AI), deep learning, machine learning, cybersecurity, blockchain, and nonthermal and advanced thermal processing. Nonthermal technologies include high-power ultrasound, pulsed electric fields, high-voltage electrical discharge, high-pressure processing, UV-LED, pulsed light, and e-beam; advanced thermal food processing techniques include microwave processing, ohmic heating, high-pressure homogenization, etc. The section will include research presenting the state of the art in the tools of Industry 4.0, including smart manufacturing, simulations, and process integrations that are applied or can be implemented in industry. Current research and applications of digitalization, Internet of Things (IoT), additive technologies (3D printing), cloud data storage, and smart sensors in connection with applications of nonthermal and advanced thermal technologies will be highly welcome, as will research considering the synergies of combination and connective application of nonthermal technologies and advanced thermal technologies. Authors are also encouraged to submit research and review papers on the applications of artificial intelligence (AI), deep learning, machine learning, cybersecurity, and blockchain in nonthermal and advanced thermal processing.

The application of digitalization is rooted in the idea of sustainability: it enables the reduction of working temperatures, energy and water consumption, and carbon footprint, while improving life cycle assessment parameters. Nonthermal and advanced thermal technologies can also be applied as sustainable techniques, working in line with the Sustainable Development Goals (SDG) and Agenda 2030 issued by United Nations (UN). Download Section Flyer

  • industry 4.0
  • digitalization
  • internet of things (IoT)
  • additive technologies (3D printing)
  • sustainability
  • artificial intelligence (AI), cybersecurity
  • blockchain, nonthermal techniques
  • advanced thermal techniques
  • other processes

Editorial Board

Special Issues

Following special issues within this section are currently open for submissions:

Papers Published

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