Advances in Integrated Silicon Photonics

Dear Colleagues,

Integrated silicon photonics has emerged as a powerful and scalable platform for realizing high-performance optical systems, enabling a wide range of applications in communications, sensing, metrology, and quantum technologies. In particular, silicon nitride (SiN) and silicon-based photonic integrated circuits have demonstrated unprecedented capabilities in achieving ultra-low-loss waveguides, high-Q resonators, and compact, narrow-linewidth laser systems. These advances are driving the development of chip-scale coherent light sources and precision photonic systems with enhanced stability and functionality.

With the rapid progress in micro/nanofabrication technologies and heterogeneous integration approaches, such as micro transfer printing and hybrid integration of gain materials and photonic integrated circuits (PICs), it is now possible to realize complex photonic systems on a single chip. Precise control over optical loss, dispersion, and coupling enables improved performance in terms of linewidth, coherence, and system stability.

In such integrated platforms, challenges related to fabrication tolerance, thermal effects, and long-term stability remain critical. Addressing these challenges requires a deep understanding of device physics, material properties, and system-level design, as well as innovations in CMOS-compatible fabrication and packaging techniques.

This Special Issue aims to present original, state-of-the-art research articles covering recent advances in integrated Si/SiN photonics, with a particular focus on low-loss platforms, high-coherence light sources, and advanced photonic integrated systems. Researchers are invited to submit their contributions to this Special Issue. Topics include, but are not limited to, the following:

• Silicon photonics;
• Silicon nitride (SiN) platforms;
• Ultra-low-loss waveguides;
• High-Q resonators and reference cavities;
• Integrated narrow-linewidth lasers;
• Heterogeneous integration and micro transfer printing;
• Photonic integrated circuits (PICs);
• CMOS-compatible fabrication;
• Advanced packaging and system integration.

Dr. Chuan Zhong
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• silicon photonics
• silicon nitride (SiN) platforms
• ultra-low-loss waveguides
• high-Q resonators and reference cavities
• integrated narrow-linewidth lasers
• heterogeneous integration and micro transfer printing
• photonic integrated circuits (PICs)
• CMOS-compatible fabrication
• advanced packaging and system integration