Special Issue "Tungsten-Based Nanomaterials: Thermology and Mechanical Properties"

A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Synthesis, Interfaces and Nanostructures".

Deadline for manuscript submissions: 28 February 2021.

Special Issue Editors

Prof. Dr. Marco G. Beghi
Website
Guest Editor
Department of Energy, Politecnico di Milano, Milan, Italy
Interests: Nanotechnology; Brillouin Spectroscopy; thin film thermo-mechanical properties; nuclear fusion; high energy radiation-matter interaction
Dr. David Dellasega
Website
Guest Editor
Department of Energy, Politecnico di Milano, Milan, Italy
Interests: Nanotechnology; Nuclear Fusion; Laser driven ion acceleration; Pulsed Laser Deposition; HiPIMS; Boron coatings

Special Issue Information

Dear Colleagues,

Because of its unique mix of properties such as high thermal stability, hardness, and low electrical resistivity, tungsten and tungsten-based materials, namely oxides and nitrides, are extensively studied in many fields such as microelectronics, x-ray lithography, electrochromic devices, and catalysis. Moreover, tungsten is the metal of choice in large scale applications such as in Tokamaks, the next generation fusion reactors.

The advent of fabrication and characterization at the nanoscale has allowed the discovery of a wide spectrum of nanostructures ranging from tungsten oxide nanowires to porous fuzzy-W, with a corresponding wide variety of new properties. The mechanical and thermomechanical features of such nanostructures are of great interest in many technology fields that range from nanoelectromechanical systems and sensors to the coating of structural components in nuclear fusion research. Upon reduction to nanometric scale, the main deformation mechanisms can also change. Research is active in this direction.

This Special Issue of Nanomaterials, “Tungsten-Based Nanomaterials: Thermology and Mechanical Properties,” aims to collect a compilation of articles that demonstrates the continuous efforts in the development of tungsten-based nanomaterials which are of interest for their thermomechanical properties. It focuses on the synthesis of nanostructured tungsten-based material, on the characterization of their properties, and on the comprehension of the microscopic mechanisms underlying several peculiar behaviors.


Prof. Dr. Marco G. Beghi
Dr. David Dellasega
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Nanomaterials is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Nanowires
  • Nanopillars
  • Microelectromechanical systems
  • Size effects
  • Dislocations
  • Thin layers
  • Deformation mechanisms
  • Nanostructured materials
  • Fuzzy tungsten
  • Thermal conductivity

Published Papers

This special issue is now open for submission.
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