Conferences

8–10 November 2016, San Francisco, CA, USA
The 2006 IEEE International Conference on 3D System Integration (3DIC 2016)

3D IC will cover all 3D IC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world.

https://www.3dic-conf.org/

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