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Special Issue "Grain Growth in Metals and Alloys"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Metals and Alloys".

Deadline for manuscript submissions: 20 April 2023 | Viewed by 161

Special Issue Editors

Department of Physics, National Tsing Hua University, Hsinchu 30013, Taiwan
Interests: pattern formation in materials and soft matters; surfaces and interfaces at the nanoscale; crystal morphology; microstructural evolution; atomistic continuum modelling of materials
Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology Bombay, Powai, Mumbai 400076 India
Interests: phase field modelling; materials thermodynamics and mechanics; phase transformations; atomistic and continuum modelling of microstructural evolution; phase transformation and deformation induced microstructures

Special Issue Information

Dear Colleagues,

Studies of grain growth are of interest from both fundamental and applied points of view. It is no wonder that grain growth is an active area of study for more than seven decades. More importantly, in recent years, there have been several important developments in both experimental and modeling studies of grain growth and associated phenomena (such as recrystallization).  The aim of this special volume is to review/overview some of these recent developments as well as place them in perspective and context. In addition to such reviews/overviews, we also welcome technical research papers that describe new methodologies, techniques, and results broadly in the area of grain growth and associated phenomena in metallic systems.

We cordially invite you to submit your contribution to this issue, whose topics include, but are not limited to the following:

  • Grain growth in metals and alloys;
  • Grain growth in thin films;
  • Grain boundary engineering;
  • Stress-induced grain growth;
  • Recrystallization—static and dynamic;
  • Grain boundary sliding, grain rotation and associated phenomena;
  • Abnormal grain growth and particle pinning effects on grain growth;
  • Effect of energy and kinetic anisotropy on grain growth;
  • Modeling grain growth—Q-state Potts, Molecular Dynamics (MD), Cellular Automaton (CA), Phase Field (PF), Phase Field Crystal (PFC) and other continuum models.

Prof. Kuo-An Wu
Prof. M P Gururajan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2300 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • Grain growth
  • Grain boundary sliding
  • Grain rotation
  • Grain boundary engineering
  • Abnormal grain growth
  • Particle pinning
  • Static recrystallization
  • Dynamic recrystallization
  • Thin films
  • Stress-assisted grain growth
  • Modelling and simulation

Published Papers

This special issue is now open for submission.
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