Special Issue "Lifetime Prediction and Fracture and Damage Mechanics of Microelectronic Systems"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Physics".

Deadline for manuscript submissions: 30 November 2020.

Special Issue Editors

Dr. Olaf van der Sluis
Guest Editor
Eindhoven University of Technology, The Netherlands & Philips Research, Eindhoven, The Netherlands
Interests: fracture mechanics; adhesion; multiscale mechanics; thin film mechanics; finite element analysis; microelectronics; medical devices
Prof. Dr. Bernhard Wunderle
Guest Editor
Chemnitz University of Technology, Germany & Fraunhofer Institute for Electronic Nano Systems (ENAS), Germany & Joint Lab Berlin for Technical Safety, Berlin, Germany
Interests: physics-of-failure-based lifetime prediction; fracture mechanics; multiscale material and interface characterization; failure analytical methods for advanced systems integration; thermal management
Prof. Dr. Abhijit Dasgupta
Guest Editor
University of Maryland, USA & Center for Advanced Life Cycle Engineering (CALCE), USA
Interests: Multiscale nanomechanics and micromechanics for material constitutive behavior and material/interface degradation mechanisms; mechanistic models for materials design, virtual testing, and health monitoring; accelerated stress testing of microelectronic systems using combined stress environments; heterogeneous integration in microsystems

Special Issue Information

Dear Colleagues,

Due to the ongoing miniaturization, increasing complexity as well as the rising demand for decreasing time-to-market, the development of advanced and highly reliable microelectronic systems (such as MEMS, NEMS, SIPs, solar cells, ultrasound transducers, and sensors) has been one of the major challenges in the microelectronics industry. This complexity originates from the fact that multiple materials are being used with a high mismatch in their properties (e.g., pairing of metals and polymers). Furthermore, these properties are strongly dependent on the complex processing history (e.g., multiple steps during cleanroom manufacturing). In addition, critical failure mechanisms are governed by the initiation of a failure event at the smallest scale and are thus multiscale in nature.

From an academic point of view, a fundamental understanding of those critical failure mechanisms that govern the lifetime of microelectronic devices is of paramount importance to predict and thus prevent failure. From an industrial point of view, an accurate prediction of the lifetime of these devices and, ideally, the ability to extend or tailor their lifetime is the prerequisite to successfully develop highly reliable next-generation devices and systems.

This Special Issue invites contributions that focus on fundamental understanding of failure processes in microelectronic systems by means of multiscale (computational) fracture and damage mechanics approaches, and/or lifetime prediction models as well as high-fidelity experimentation. In particular:

  • Multiscale approaches that establish the relation between cleanroom processing and intrinsic stresses in (multilayered) thin films;
  • Multiscale approaches for adhesion prediction in multilayered thin films;
  • Residual stress reduction/controlling methods based on physics-based models;
  • Novel fracture and damage mechanics models to calculate remaining lifetime (RuL);
  • Hybrid models that combine physics-based and data-based models for lifetime prediction;
  • Physics-based interconnect lifetime prediction;
  • Multiscale fracture mechanics approaches on bulk and interface level for (heterogeneously) integrated components, devices and systems in simulation and experiment;
  • (Multiscale) fracture mechanics-based bulk and interface characterization methods for advanced materials;
  • Localized residual stress measurements for fracture mechanics evaluation;
  • Inclusion of mode mix, moisture, temperature, and corrosive effects on crack growth;
  • Alternative computational methods for fracture and damage mechanics (such as BEM, peridynamics, and DEM);
  • Process–structure–property correlations with respect to fracture properties;
  • Advanced crack tracing methods;
  • Multiphysics failure mechanisms, such as creep–fracture failures, stress–corrosion cracking, and electromigration- and thermomigration-driven weakening of fracture toughness.

Dr. Olaf van der Sluis
Prof. Dr. Bernhard Wunderle
Prof. Dr. Abhijit Dasgupta
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • Fracture mechanics
  • Damage mechanics
  • Microelectronic systems
  • Residual stress
  • Multiscale
  • Adhesion
  • Delamination
  • Stress–corrosion cracking
  • Electromigration and thermomigration

Published Papers

This special issue is now open for submission.
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