New Advances in Soft Magnetic Materials

Dear Colleagues,

For this Special Issue, we welcome manuscripts of soft magnetic materials and soft matter systems, including conventional and new manufacturing processes, such as thin-film methods and additive manufacturing. Soft magnetic materials have been widely used on sensors and electromagnetic devices. Emerging applications are focused on electric vehicles, 5G communication, and high-frequency power conversion. The soft matter applications are based on magnetic interactions. Nevertheless, soft nanoparticles, soft magnetic composites and spring magnets opened new pathways. Functional properties are highly dependent on the microstructure and its thermal stability. Apart from the traditional magnetic materials, based on Fe-, Co- or Ni-rich alloys, new families of materials, such as high entropy alloys, have recently been developed. The manuscripts can be related to a specific alloy (or alloy family), new materials, new applications, magnetic simulation (micro, nano), and to materials/composition selection by machine learning and/or artificial intelligence. Review manuscripts are also welcomed.

Dr. Lluïsa Escoda
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.