Recent Research in Advanced Materials: Multi-Scale Simulation, Physical and Mechanical Properties
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Mechanics of Materials".
Deadline for manuscript submissions: 10 November 2026
Special Issue Editors
2. School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
Interests: microstructure control; advanced materials; shape memory alloys; preparation and processing; intelligent material device design; mechanical properties control; multi-scale simulation simulation
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
In the era of rapid technological advancement, advanced materials have emerged as a cornerstone driving industrial upgrading and innovation across strategic sectors such as aerospace, renewable energy, biomedical engineering, and high-end manufacturing. The optimization and design of material properties have transitioned from traditional trial-and-error approaches to precision research guided by multi-scale modeling and interdisciplinary theory. This Special Issue, titled "Recent Research in Advanced Materials: Multi-Scale Simulation, Physical and Mechanical Properties," focuses on the deep integration of multi-scale modeling methods with experimental techniques to explore material behavior across atomic, microscopic, and macroscopic scales and their correlations with physico-mechanical properties. It aims to provide a premier platform for global scholars to exchange ideas and accelerate the translation of advanced materials from fundamental research to practical applications. We welcome contributions in (but not limited to) the following areas:
- Innovations in multi-scale modeling methods: Covering molecular dynamics, phase-field methods, density functional theory, discrete element methods, and finite element analysis, with a focus on breakthroughs in designing advanced.
- Cross-scale mechanisms of physico-mechanical properties: Investigating material responses under complex loading conditions and extreme environments, while revealing quantitative relationships between microstructural evolution and macroscopic performance.
- High-performance computing and AI-driven advancements: Exploring cutting-edge applications of machine learning and big data analytics in material behavior prediction, parameter inversion, and multi-scale model coupling to enhance computational efficiency and accuracy.
- Synergistic studies combining advanced characterization and modeling: Integrating in situexperiments, synchrotron radiation, electron microscopy, and neutron scattering to validate multi-scale simulations and establish a closed-loop "experiment–simulation" research paradigm.
- Engineering-oriented material design: Developing multi-scale optimization strategies to achieve performance targets such as lightweighting, high strength-to-weight ratios, extreme environment resistance, and smart responsiveness, with applications in aerospace, energy storage, and flexible electronics.
Dr. Jili Liu
Dr. Tara Schiller
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- advanced materials
- multi-scale modeling
- multifield coupling
- physico-mechanical properties
- cross-scale correlation
- high-performance computing
- machine learning
- advanced characterization techniques
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