Special Issue "Metaverse: Current Status and Future Possibilities"

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: 31 December 2022

Special Issue Editors

Dr. Hyun K. Kim
E-Mail Website
Guest Editor
School of Information Convergence, Kwangwoon University, Seoul 01897, South Korea
Interests: metaverse UX; accessibility and digital inequality; AI UX (artificial intelligence user experience); human–AI interaction

Special Issue Information

Dear Colleagues,

Globally, interest in the metaverse, a virtual world in a digital environment, is higher than ever. The metaverse platform is similar to games, but in the case of the metaverse, 1) users can directly create content within the platform, 2) economic activities are possible, and 3) user-created content directly affects the virtual world.

Virtual reality (VR), augmented reality (AR), and mixed reality (MR) technologies are all technologies for implementing the metaverse. The user's experience of using the metaverse varies depending on what technology is used to access the metaverse platform. In the commercialized metaverse world, platform access through mobile phones or PC environments is predominant, but VR, AR, and MR environments are expected to receive more attention in the future, with the metaverse gradually converging with AI technology. Researches such as data-based AI algorithms applied to the metaverse, the application of AI technology for voice/face/body recognition within the platform, and virtual world expansion using AI technology are being actively studied.

As metaverse research is expected to undergo many changes in the future with the development of various technologies, this Special Issue aims to discuss the current status of metaverse research and future development. The scope includes theoretical and experimental studies that contribute metaverse-related technology, content, platform, business, user interface, and user experience.

In this Special Issue, original research articles and reviews are welcome, research areas including (but not limited to) the following:

  • Metaverse research trends
  • Metaverse and AI algorithm
  • Virtual, mixed, and augmented reality
  • User experience in the metaverse
  • Metaverse and games
  • Human–computer interaction

Dr. Hyun K. Kim
Prof. Dr. Jaehyun Park
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • metaverse research
  • artificial intelligence
  • virtual reality
  • augmented reality
  • mixed reality
  • user experience
  • user interface

Published Papers

This special issue is now open for submission.
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