Seong-Hee Han received his B.S. and M.S. degrees in Radio Science and Engineering from Chungnam National University, Daejeon, Republic of Korea, in 2021 and 2023, respectively. He is currently a Ph.D. candidate at the same university. His research interests include 3D printing techniques for microwave components, as well as GaAs pHEMT and GaN HEMT monolithic integrated circuits for microwave, millimeter-wave, and sub-THz front-end applications.

Dong-Wook Kim received his B.S. degree in Electronic Communications from Hanyang University, Seoul, Republic of Korea, in 1990, followed by his M.S. and Ph.D. degrees in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea, in 1992 and 1996, respectively. In 1996, he joined the LG Electronics Research Center in Seoul, where he developed high-power III–V semiconductor devices and monolithic microwave integrated circuits.From 2000 to 2002, he served as the Director of the R&D Center at Telephus Inc., leading research teams in the development of RF-integrated passive devices on thick oxidized silicon substrates and their applications. Between 2002 and 2004, he led the development of wireless security systems as a team leader at S1 Corporation, a subsidiary of the Samsung Group.In 2004, he joined the faculty of Chungnam National University in Daejeon, where he is currently a full professor. In 2009, he was invited to join the Electronics and Telecommunications Research Institute (ETRI) as a researcher. In 2010, he became a visiting scholar at the University of California, San Diego, in La Jolla. He has been a senior member of IEEE since 2017. His research interests include GaAs- and GaN-based MMICs, internally matched power amplifiers, and microwave/millimeter-wave embedded modules, including miniaturized radar/sensor modules and ultra-wideband high-power modules.