Dr. Jibing Chen has a position as an associate professor, master’s supervisor, and head of the Department of Materials Forming and Control Engineering. He is currently working at the College of Mechanical Engineering, Wuhan Polytechnic University. He received his master’s and doctoral degrees in materials processing engineering from Huazhong University of Science and Technology in 2006 and 2013, respectively. He is mainly engaged in research in the fields of powder and food additive manufacturing (3D printing) technology, electronic packaging technology, and high-power device reliability. He is currently a director of the Plastic Engineering Professional Committee of the Hubei Mechanical Engineering Society. He has presided over or participated in more than 10 provincial and ministerial projects, published more than 50 academic papers in domestic and foreign journals, including more than 40 papers included in SCI and EI, applied for more than 90 patents, including 12 authorized invention patents, and edited and published three “14th Five-Year Plan” mechanical planning textbooks for general colleges and universities. He serves as a reviewer for more than 10 SCI journals, including Rapid Prototyping Journal, Materials, Machines, Sensors, Part C: Journal of Mechanical Engineering Science, Part E: Journal of Process Mechanical Engineering, Journal of Laser Applications, and Soldering & Surface Mount Technology.
Yiping Wu is the chief professor of the Electronic Packaging Research Center, at Huazhong University of Science and Technology. He received his B.Sc., M.S., and Ph.D. degrees from the Huazhong University of Science and Technology, Wuhan, China, in 1982, 1986, and 2000, respectively. He founded the Electronic Packaging Research Center at Huazhong University of Science and Technology in 1999. His main research interests include microelectronic packaging, power electronic devices, and optoelectronic devices.
