Jun Cao is an associate professor at the Henan Polytechnic University. He is mainly engaged in research on intelligent materials and structural design, high-performance alloy materials and processing, advanced directional solidification technology, halogen-free surface treatment of materials (Direct Coating), and microelectronic packaging material technology and device reliability. In the past five years, he has undertaken two key scientific and technological projects in Henan Province and many other joint development projects. He has developed high-tech materials such as high-purity single-crystal copper with a purity higher than 99.9999%, high-strength and high-conductivity copper alloys, and high-performance new bonding wires; proposed the use of bonding copper wires and bonding alloy wires instead of bonding alloy wires for micro in electronic packaging; and achieved groundbreaking results in research on semiconductor packaging bonding copper wires, bonding alloy wires, and their reliability. He has published more than 20 papers, authorized more than 15 related invention patents, and been invited to give special reports at ICEP (International Conference on Electronics Packaging) and IMPACT (International Microsystems, Packaging, Assembly and Circuits Technology) many times.
