Launching the Semiconductors and Heterogeneous Integration Journal

The semiconductor industry stands at a transformative crossroads. As Moore’s Law for CMOS device downsizing approaches its physical limits—and has arguably already encountered economic and manufacturability constraints—the urgency for novel architectures, materials, and integration strategies has never been greater [1,2]. Heterogeneous integration [3,4,5,6,7,8,9,10,11]—enabling the unification of diverse components, such as logic, memory, sensors, photonics, and power devices, into a single system; combining the scalability of silicon-based mass production technology with the unique properties of high-speed compound semiconductors, wide-bandgap materials, and the emerging two-dimensional materials—offers a compelling path forward for “More Moore” and “More-than-Moore” [2,4,11]. This paradigm shift allows for performance scaling beyond transistor density, emphasizing system-level optimization, functional diversity, and architectural ingenuity [1]. A deeper understanding of the fundamental physics governing both conventional and emerging semiconductor materials—and the opportunities and limitations of devices in non-classical applications—will be essential to unlocking the full potential of this technology.

It is with great enthusiasm that we inaugurate this state-of-the-art scientific and technological journal, Semiconductors and Heterogeneous Integration (SHI), a new scholarly platform dedicated to advancing the frontiers of micro- and nanoelectronics. In an era marked by the end of traditional device scaling and the rise of complex, convergent system designs for a digitized and intelligent world, SHI aims to serve as a nexus for interdisciplinary research and collaboration across academia and industry.

Our scope encompasses a broad range of topics, including but not limited to the following:

• Novel processes, device structures, and applications of conventional semiconductor materials.
• High-speed compound semiconductors for photonic and terahertz applications.
• Integration of 2D materials with mainstream silicon technologies.
• Wafer bonding and advanced packaging technology for 3D integration.
• Chiplet architectures and high-performance interconnect technologies.
• Materials science, process optimization, and reliability in heterogeneous systems.
• System-on-chip (SoC), chip-embedded-chip, and heterogeneous integration for AI platforms, wearables, and implantable biomedical electronics.

SHI is committed to publishing rigorous, peer-reviewed research in semiconductor science and integration technology that deepens scientific understanding and accelerates technological translation for advanced integration circuit manufacturing. In addition to regular articles, reviews, and short communications, we offer an express track for the rapid dissemination of breakthrough discoveries. We also welcome visionary perspectives that challenge conventional paradigms and illuminate emerging directions.

Our editorial board comprises leading experts from around the world, reflecting the global and interdisciplinary nature of this field. We are dedicated to upholding the highest standards of scholarship, inclusivity, and transparency.

To our readers, contributors, and reviewers: thank you for joining us on this exciting journey. Together, we will shape the discourse, define the challenges, and celebrate the innovations that will drive the next wave of semiconductor technology advancement.