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Journal: J. Manuf. Mater. Process., 2025
Volume: 9
Number: 352
Article:
Optimization of Direct Bonding Process for Lotus-Type Porous Copper to Alumina Substrates
Authors:
by
Sang-Gyu Choi, Sangwook Kim, Jinkwan Lee, Keun-Soo Kim and Soongkeun Hyun
Link:
https://www.mdpi.com/2504-4494/9/11/352
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