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Journal: J. Manuf. Mater. Process., 2025
Volume: 9
Number: 352

Article: Optimization of Direct Bonding Process for Lotus-Type Porous Copper to Alumina Substrates
Authors: by Sang-Gyu Choi, Sangwook Kim, Jinkwan Lee, Keun-Soo Kim and Soongkeun Hyun
Link: https://www.mdpi.com/2504-4494/9/11/352

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