Sapienza, S.; Belsito, L.; Ferri, M.; Elmi, I.; Zielinski, M.; La Via, F.; Roncaglia, A.
Fabrication of Wafer-Level Vacuum-Packaged 3C-SiC Resonators with Q-Factor above 250,000. Proceedings 2024, 97, 44.
https://doi.org/10.3390/proceedings2024097044
AMA Style
Sapienza S, Belsito L, Ferri M, Elmi I, Zielinski M, La Via F, Roncaglia A.
Fabrication of Wafer-Level Vacuum-Packaged 3C-SiC Resonators with Q-Factor above 250,000. Proceedings. 2024; 97(1):44.
https://doi.org/10.3390/proceedings2024097044
Chicago/Turabian Style
Sapienza, Sergio, Luca Belsito, Matteo Ferri, Ivan Elmi, Marcin Zielinski, Francesco La Via, and Alberto Roncaglia.
2024. "Fabrication of Wafer-Level Vacuum-Packaged 3C-SiC Resonators with Q-Factor above 250,000" Proceedings 97, no. 1: 44.
https://doi.org/10.3390/proceedings2024097044
APA Style
Sapienza, S., Belsito, L., Ferri, M., Elmi, I., Zielinski, M., La Via, F., & Roncaglia, A.
(2024). Fabrication of Wafer-Level Vacuum-Packaged 3C-SiC Resonators with Q-Factor above 250,000. Proceedings, 97(1), 44.
https://doi.org/10.3390/proceedings2024097044