Dual-Core Hierarchical Fuzzing Framework for Efficient and Secure Firmware Over-the-Air
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Kim, N.-H.; Lee, J.-M.; Lee, I.-G. Dual-Core Hierarchical Fuzzing Framework for Efficient and Secure Firmware Over-the-Air. Electronics 2025, 14, 2886. https://doi.org/10.3390/electronics14142886
Kim N-H, Lee J-M, Lee I-G. Dual-Core Hierarchical Fuzzing Framework for Efficient and Secure Firmware Over-the-Air. Electronics. 2025; 14(14):2886. https://doi.org/10.3390/electronics14142886
Chicago/Turabian StyleKim, Na-Hyun, Jin-Min Lee, and Il-Gu Lee. 2025. "Dual-Core Hierarchical Fuzzing Framework for Efficient and Secure Firmware Over-the-Air" Electronics 14, no. 14: 2886. https://doi.org/10.3390/electronics14142886
APA StyleKim, N.-H., Lee, J.-M., & Lee, I.-G. (2025). Dual-Core Hierarchical Fuzzing Framework for Efficient and Secure Firmware Over-the-Air. Electronics, 14(14), 2886. https://doi.org/10.3390/electronics14142886