Yang, B.; Chen, Y.; Hao, W.; Han, Y.; Zhang, Q.; Li, Y.; Wang, X.; Huang, L.; Lu, Y.
The Corrosion Behavior of Different Silver Plating Layers as Electrical Contact Materials in Sulfur-Containing Environments. Coatings 2023, 13, 1796.
https://doi.org/10.3390/coatings13101796
AMA Style
Yang B, Chen Y, Hao W, Han Y, Zhang Q, Li Y, Wang X, Huang L, Lu Y.
The Corrosion Behavior of Different Silver Plating Layers as Electrical Contact Materials in Sulfur-Containing Environments. Coatings. 2023; 13(10):1796.
https://doi.org/10.3390/coatings13101796
Chicago/Turabian Style
Yang, Bingkun, Yun Chen, Wenkui Hao, Yu Han, Qiang Zhang, Yujie Li, Xiaofang Wang, Luyao Huang, and Yiliang Lu.
2023. "The Corrosion Behavior of Different Silver Plating Layers as Electrical Contact Materials in Sulfur-Containing Environments" Coatings 13, no. 10: 1796.
https://doi.org/10.3390/coatings13101796
APA Style
Yang, B., Chen, Y., Hao, W., Han, Y., Zhang, Q., Li, Y., Wang, X., Huang, L., & Lu, Y.
(2023). The Corrosion Behavior of Different Silver Plating Layers as Electrical Contact Materials in Sulfur-Containing Environments. Coatings, 13(10), 1796.
https://doi.org/10.3390/coatings13101796
