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Journal: Nanomaterials, 2025
Volume: 15
Number: 1600
1600
Article: Cu-Contamination-Free Hybrid Bonding via MoS₂ Passivation Layer
Authors: by Hyunbin Choi, Kyungman Kim, Sihoon Son, Dongho Lee, Seongyun Je, Jieun Kang, Sunjae Jeong, Doo San Kim, Minjong Lee, Jiyoung Kim and Taesung Kim
Link: https://www.mdpi.com/2079-4991/15/20/1600

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