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Open AccessArticle

Design of All-Solid Dual-Concentric-Core Microstructure Fiber for Ultra-Broadband Dispersion Compensation

Intelligence and Information Engineering College, Tangshan University, Tangshan 063000, China
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Appl. Sci. 2019, 9(16), 3366; https://doi.org/10.3390/app9163366
Received: 16 July 2019 / Revised: 6 August 2019 / Accepted: 9 August 2019 / Published: 15 August 2019
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Abstract

In this paper, the all-solid dual-concentric-core microstructure fiber (MSF) with ultra-broadband dispersion compensation characteristics is designed. The effects of microstructure fiber structure parameters on dispersion, phase-matching wavelength, and kappa value are analyzed by the multi-pole method and mode coupling theory. The average dispersion compensation multiple is 18.45, that is, 1 km long dispersion compensated MSF can compensate for the cumulative dispersion of standard single-mode fiber of 18.45 km in the wavelength range of 1385~1575 nm by optimizing MSF parameters. The change range of residual dispersion is within ±0.72 ps/(nm·km), and the splicing loss with standard single-mode fiber is controlled below 5 dB within the compensation bandwidth of 190 nm. Compared with the air hole-quartz structure dual-concentric-core microstructure fiber, the designed fiber reduces the difficulty of fiber drawing, is easy to splice with standard single-mode fiber, and has wider compensation bandwidth as well as larger compensation multiple than the existing microstructure fiber. This lays a solid foundation for the optimization of dense wavelength division multiplexing networks and the construction of all-optical networks. View Full-Text
Keywords: microstructure fiber; broadband dispersion compensation; all-solid; dual-concentric-core; residual dispersion microstructure fiber; broadband dispersion compensation; all-solid; dual-concentric-core; residual dispersion
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Wang, C.; Zhang, Y.; Wu, Z.; Zhang, G.; Zhang, Y.; Jiang, L. Design of All-Solid Dual-Concentric-Core Microstructure Fiber for Ultra-Broadband Dispersion Compensation. Appl. Sci. 2019, 9, 3366.

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