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Investigation on Springback Behavior of Cu/Ni Clad Foils during Flexible Die Micro V-Bending Process

School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China
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Metals 2019, 9(8), 892; https://doi.org/10.3390/met9080892
Received: 4 July 2019 / Revised: 8 August 2019 / Accepted: 13 August 2019 / Published: 15 August 2019
(This article belongs to the Special Issue Clad Metals: Fabrication, Properties and Applications)
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Abstract

With the increasing demand for micro parts using metal laminates in modern production, the manufacturing processes of thin sheet parts have been elevated. However, it is difficult to predict the deformation behavior with miniaturization because of size effects in micro-scale. In this study, the flexible die micro V-bending behavior of Cu/Ni clad foils was investigated. The bending experiments with three different punch angles and Cu/Ni clad foils under different annealed temperatures were performed. The results show that the springback angle increases with the increase of bending angle and annealing temperature. The placement of Cu/Ni clad foils induced compressive stress results in the more obvious thinning of thickness and decreasing of springback angle. The interactive effects of the distribution of deformation zones and compressive stress induced by the interface layer result in the springback behavior of Cu/Ni clad foils during the flexible die micro V-bending process. View Full-Text
Keywords: Cu/Ni clad foils; flexible die micro V-bending; bending angle; springback Cu/Ni clad foils; flexible die micro V-bending; bending angle; springback
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Wang, C.; Wang, S.; Wang, S.; Chen, G.; Zhang, P. Investigation on Springback Behavior of Cu/Ni Clad Foils during Flexible Die Micro V-Bending Process. Metals 2019, 9, 892.

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