- freely available
Metals 2016, 6(9), 220; doi:10.3390/met6090220
2. Experimental Procedure
2.1. Material Selection
2.2. Joining Procedure and Soldering Process Set Up
2.3. Joint Strength Analysis
2.4. Microstructural Analysis
3. Results and Discussion
3.1. Verification of Porosity Percentage
3.2. Effect of Porous Cu Interlayer Addition on Joint Strength
3.3. Effect of Porous Cu Interlayer Addition on Fracture Behaviour
3.3.1. Fractured Surface
3.3.2. Cross-Sectional Analysis
3.4. Interfacial Structure Analysis
3.5. Measurement of IMC Thickness
- The joint strength of the Pb-free SAC305 solder joint with the addition of porous Cu interlayer generally increased alongside with increasing soldering time and temperature.
- The highest strength for the solder joint with P25 porous Cu addition was recorded at 51 MPa, at soldering time of 180 s and temperature of 307 °C, whereas the 54 MPa highest strength was achieved with P15 porous Cu addition at 300 s with 307 °C.
- For solder joints without porous Cu, fracture occured along the interface of solder alloy and Cu substrate. In the case of solder joints soldered with P15 and P25 porous Cu interlayer, fractures occured at three regions, namely at the interface of solder and porous Cu interlayer, inside the porous Cu interlayer as well as inside the solder itself.
- Microstructural analysis at the interfacial regions revealed the IMC phase at the SAC305/Cu substrate interface to have a scallop-liked configuration. With addition of porous Cu, both typical scallop-shaped as well as more uniform and continuous layers of IMC phases were observed. The typical scallop-liked configurations were more dominant for the solder joint with P15 porous Cu at the SAC305/P15 porous Cu interface, whereas the latter phase appeared to be more prominent for the solder joint with P25 porous Cu at the SAC305/P25 porous Cu interface.
- The IMC layer at the interface of solder alloy and Cu substrate of all specimens was thicker than that at the interface of solder alloy and porous Cu. The IMC layers at these two regions also increased with soldering temperature. The uneven contact area at the interface of porous Cu and solder alloy resulted in the formation of a less pronounced IMC layer.
Conflicts of Interest
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|Solder Alloy||Melting Temperature, °C||Tensile Strength, MPa||Young Modulus, MPa||Hardness, HV|
|Soldering temperature, °C||267, 287, 307|
|Soldering time, s||60, 180, 300|
|Porous Cu||0, P15, P25|
|Point||Element (at. %)|
|Soldering Temperature, °C||IMC Thickness, µm|
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