Liu, H.; Yang, T.; Han, J.; Tian, X.; Chen, S.; Lu, L.
Obtainment of Residual Stress Distribution from Surface Deformation under Continuity Constraints for Thinned Silicon Wafers. Machines 2021, 9, 284.
https://doi.org/10.3390/machines9110284
AMA Style
Liu H, Yang T, Han J, Tian X, Chen S, Lu L.
Obtainment of Residual Stress Distribution from Surface Deformation under Continuity Constraints for Thinned Silicon Wafers. Machines. 2021; 9(11):284.
https://doi.org/10.3390/machines9110284
Chicago/Turabian Style
Liu, Haijun, Tao Yang, Jiang Han, Xiaoqing Tian, Shan Chen, and Lei Lu.
2021. "Obtainment of Residual Stress Distribution from Surface Deformation under Continuity Constraints for Thinned Silicon Wafers" Machines 9, no. 11: 284.
https://doi.org/10.3390/machines9110284
APA Style
Liu, H., Yang, T., Han, J., Tian, X., Chen, S., & Lu, L.
(2021). Obtainment of Residual Stress Distribution from Surface Deformation under Continuity Constraints for Thinned Silicon Wafers. Machines, 9(11), 284.
https://doi.org/10.3390/machines9110284